
Thermal Testing
Hot/cold chambers, temperature cycling and humidity exposure.
CONTACT →Built for dependable performance in demanding environments. An engineering-led approach to SD, microSD, SSD and DRAM qualification.

Qualification may include thermal, mechanical, electrical and inspection methods, selected to match the operating conditions and acceptance criteria of each storage or memory product.

Hot/cold chambers, temperature cycling and humidity exposure.

Shaker-based mechanical vibration and shock qualification.

Corrosion resistance evaluation where exposure warrants it.

Repeated insertion and removal cycles of connectors and sockets.

Interface behavior, electrical measurements and data integrity.

Visual inspection, microscopy and failure investigations.
Equipment photographs illustrate representative test methods, not a claim that Rexstor owns these facilities or that every product has passed every test. Actual test scope and reports must be confirmed for the selected model.
Different markets require different documentation, component qualifications and equipment-level validation. We help identify the relevant requirements for each application.
01AEC-Q100 IC qualification · IATF 16949 supply-chain requirements
EXPLORE APPLICATION →
02ISO 13485 supplier controls · traceability and change management
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03AS/EN 9100 supplier quality · DO-160 equipment test considerations
EXPLORE APPLICATION →
04EN 50155 equipment environment · EN 50121 EMC context
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05IEC 60068 environmental test methods · lifecycle controls
EXPLORE APPLICATION →
06IEC 60945 marine equipment context · project-specific verification
EXPLORE APPLICATION →Industry standards are presented as relevant frameworks or customer expectations; they do not constitute blanket Rexstor product certification. Application imagery is illustrative. Qualification must be verified against the selected product, legal entity, site and end-equipment use case.
Qualification priorities vary by technology, operating profile and endurance target.

Continuous recording, endurance, retention and host compatibility.
DISCOVER →
Workload endurance, thermal response, sustained I/O and lifecycle.
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JEDEC interface parameters, stability, timing and thermal margins.
DISCOVER →Depending on product and market, evaluation may reference JEDEC, SD interface specifications, IEC 60068 environmental methods and RoHS/REACH regulatory obligations. ISO 13485, IATF 16949 and AS/EN 9100 are organizational / manufacturing-system standards, not standalone memory-card certificates. AEC-Q100 addresses relevant integrated circuits, not automatic qualification of an entire SSD or microSD card.
Define the application and request the supporting documentation relevant to your target product, operating conditions and qualification plan.
REQUEST DOCUMENTATION →Discuss your workload, environmental constraints and industry-specific qualification expectations.